- Development of new electrical and optical micro systems
- for optical communication
- for sensor applications
- for medical products
- FEM-simulation, e.g. thermal modeling for power management, mechanical stress analysis, electro-optical RF-field analysis, and other multi-physics stresses
- Optimization of a structure, for example in order to control temperature and reduce mechanical tensions
- Introduction of new packaging and assembly technologies to volume production processes
- Introduction of wafer based production processes for hybrid micro-assembly
