InBeCon contributes to the Photonic Packaging Workshop organized by the Fraunhofer Institut, September 9 – 10, 2014

The Fraunhofer Institut for Reliability and Microintegration (IZM) organized an international workshop about photonic packaging in collaboration with the European Photonics Industry Consortium (EPIC), the OpTecBB and the PhotonicNet. It was a Forum for experts who focus on effective manufacturing strategies in Europe and automated assembly technologies for optoelectronic and photonic integration on the board, package and device levels. InBeCon GmbH presented together with the company ArgoTech a.s. about „Volume production of single mode micro-optical components with wafer-level assembly“. This production line applies wafer-level technologies from semiconductor production to the volume assembly of opto-electronic components with accuracy of about 1µm.