Packaging of Integrated Circuits

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  • Development of new electrical and optical micro systems
    • for optical communication
    • for sensor applications
    • for medical products
  • FEM-simulation, e.g. thermal modeling for power management, mechanical stress analysis, electro-optical RF-field analysis, and other multi-physics stresses
  • Optimization of a structure, for example in order to control temperature and reduce mechanical tensions
  • Introduction of new packaging and assembly technologies to volume production processes
  • Introduction of wafer based production processes for hybrid micro-assembly